NXP Semiconductors公司介绍和产品目录_NXP/恩智浦_恩智浦半导体专区_授权代理商 - 辰科物联

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array(64) { ["id"]=> string(4) "1619" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050A1HQ1/Z01SGZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "19.143070" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(17) "ECC AES DES QFN20" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598343500" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050A1HQ1/Z01SGZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： ECC AES DES QFN20	SELECT * FROM `golon_ic` WHERE ( `id` = 1619 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611619 资料：规格书/封装库	5+: ￥30.76 3000+: ￥21.57	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "1611" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050A2HQ1/Z01SHZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "19.230780" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(17) "ECC AES DES QFN20" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598343341" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050A2HQ1/Z01SHZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： ECC AES DES QFN20	SELECT * FROM `golon_ic` WHERE ( `id` = 1611 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611611 资料：规格书/封装库	5+: ￥30.90 3000+: ￥21.67	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "1612" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050C2HQ1/Z01SDZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "23.796260" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(32) "ECC RSA AES DES MIFARE KDF CL-IF" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598343356" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050C2HQ1/Z01SDZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： ECC RSA AES DES MIFARE KDF CL-IF	SELECT * FROM `golon_ic` WHERE ( `id` = 1612 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611612 资料：规格书/封装库	5+: ￥38.24 3000+: ￥26.82	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "1620" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050B2HQ1/Z01SFZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "19.384340" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(17) "RSA AES DES QFN20" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598343500" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050B2HQ1/Z01SFZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： RSA AES DES QFN20	SELECT * FROM `golon_ic` WHERE ( `id` = 1620 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611620 资料：规格书/封装库	5+: ￥31.15 3000+: ￥21.85	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "1621" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050B1HQ1/Z01SEZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "19.307550" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(17) "RSA AES DES QFN20" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1598343500" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050B1HQ1/Z01SEZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： RSA AES DES QFN20	SELECT * FROM `golon_ic` WHERE ( `id` = 1621 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611621 资料：规格书/封装库	5+: ￥31.03 3000+: ￥21.76	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "1592" ["pdf_add"]=> string(58) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050C1HQ1/Z01SCZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "21.036550" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(32) "ECC RSA AES DES MIFARE KDF CL-IF" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(21) "物联网安全元件" ["yy"]=> string(10) "工业 4.0" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1588214878" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050C1HQ1/Z01SCZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： ECC RSA AES DES MIFARE KDF CL-IF	SELECT * FROM `golon_ic` WHERE ( `id` = 1592 ) LIMIT 1 系列：类型：物联网安全元件应用：工业 4.0 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10611592 资料：规格书/封装库	5+: ￥33.81 3000+: ￥23.71	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "2026" ["pdf_add"]=> string(0) "" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "A5000R2HQ1/Z016UZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(9) "10.856110" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(30) "IC EDGELOCK SECURE AUTH CRYPTO" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(27) "边缘锁定安全认证器" ["yy"]=> string(1) "-" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "卷带" ["spq"]=> string(4) "3000" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(3) "A50" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1658214119" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： A5000R2HQ1/Z016UZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： IC EDGELOCK SECURE AUTH CRYPTO	SELECT * FROM `golon_ic` WHERE ( `id` = 2026 ) LIMIT 1 系列：类型：边缘锁定安全认证器应用：- 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10612026	5+: ￥17.45 3000+: ￥12.23	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 3000个/ 卷带修改个个卷带总额：	加入购物车
array(64) { ["id"]=> string(4) "2205" ["pdf_add"]=> string(66) "https://www.nxp.com/docs/en/data-sheet/SE050-DATASHEET.pdf?pspll=1" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> NULL ["images"]=> string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/191/568%7ESOT1969-1%7E%7E20.jpg" ["images_dir"]=> string(35) "./images/1061/SE050A1HQ1_Z01SGZ.jpg" ["ljbh"]=> string(0) "" ["zzsbh"]=> string(17) "SE050F2HQ1/Z018HZ" ["zddgs"]=> string(1) "1" ["xysl"]=> string(1) "1" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(28) "FIPS AES 3DES CL-IF I2C CTRL" ["xl"]=> string(0) "" ["zzs"]=> string(13) "NXP/恩智浦" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(12) "NXP USA Inc." ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(27) "即插即用型安全元件" ["yy"]=> string(1) "-" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(21) "20-XFQFN 裸露焊盘" ["gysqjfz"]=> string(18) "20-HX2QFN（3x3）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(14) "卷带（TR）" ["spq"]=> string(0) "" ["moq"]=> string(1) "5" ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(2) "20" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> NULL ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> NULL ["cat_id"]=> string(2) "21" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(10) "1665308679" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： SE050F2HQ1/Z018HZ复制状态：在售修改品牌： NXP/恩智浦复制封装：20-HX2QFN（3x3）外壳：20-XFQFN 裸露焊盘描述： FIPS AES 3DES CL-IF I2C CTRL	SELECT * FROM `golon_ic` WHERE ( `id` = 2205 ) LIMIT 1 系列：类型：即插即用型安全元件应用：- 工作温度：-	类别：专用IC 丝印：(请登录) 料号：10612205 资料：规格书/封装库	0755-28435922 量大可议价	购买数量不能超过商品库存，已为您修正！起订量:5 修改包装量: 卷带（TR）修改个个卷带（TR）总额：	加入购物车

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