array(65) {
["id"]=>
string(4) "2768"
["pdf_add"]=>
string(50) "https://www.nxp.com/docs/en/data-sheet/TDA8037.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(83) "//media.digikey.com/Renders/NXP%20Semi%20Renders/568;SOT403-1;DH,DP,PW,TS,TT;16.jpg"
["images"]=>
string(109) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6295/568%7ESOT403-1%7EDH%2CDP%2CPW%2CTS%2CTT%7E16.jpg"
["images_dir"]=>
string(34) "./images/1076/PCA9541PW_01,118.jpg"
["ljbh"]=>
string(16) "TDA8037TT/C1J-ND"
["zzsbh"]=>
string(13) "TDA8037TT/C1J"
["zddgs"]=>
string(4) "2500"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "3.058900"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(32) "IC INTERFACE SPECIALIZED 16TSSOP"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(9) "智能卡"
["jk"]=>
string(1) "-"
["dydy"]=>
string(4) "3.3V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(35) "16-TSSOP(宽4.40mm间距0.65mm)"
["gysqjfz"]=>
string(8) "16-TSSOP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "16"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(3) "848"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
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select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.rate,a.rate_hot,sum(a.rate+a.rate_hot/100) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy'
封装:16-TSSOP
外壳:16-TSSOP(宽4.40mm间距0.65mm)
描述:
IC INTERFACE SPECIALIZED 16TSSOP
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系列:
应用:智能卡
接口:-
电压-电源输入(V):3.3V
工作温度:-
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string(28) "'xl','yy','jk','dydy','gzwd'"
SELECT COLUMN_NAME as bt,COLUMN_COMMENT as title FROM INFORMATION_SCHEMA.Columns WHERE ORDINAL_POSITION >=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_jk_zy' AND table_schema='golon' and COLUMN_NAME='ms')+1 and ORDINAL_POSITION <=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_jk_zy' AND table_schema='golon' and COLUMN_NAME='is_new_time') and table_name='golon_jk_zy' AND table_schema='golon' and COLUMN_NAME not in('tdxl','gysqjfz','lm','fz_wk','zzs','tag','wk_cc','zzs_old','zzs_new','ljzt','spq','sqp','is_rohs','bz','gys_id','gm_gys_id','xysl','cfkc','dj','price_addtime','zddgs','spq','moq''gl_zz','gl_dm','gl_dmtp','symbol','gl_vdd','gl_gnd','gl_jz','gl_bdm','gl_bdmsm','gl_kbc','gl_dmgx','pcbfzk_id','pcbfzk','jyid','cat_id','wl_num','admin_id','mpn_bm','ch_bm','lock_dm','is_use_cat_id','is_new_time','gl_zz','gl_pin') and COLUMN_NAME not in ('xl','yy','jk','dydy','gzwd') limit 8
安装类型:表面贴装型
元器件等级:-
最小起订MOQ:5
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