array(67) {
["id"]=>
string(2) "17"
["pdf_add"]=>
string(60) "https://ww1.microchip.com/downloads/en/DeviceDoc/doc0403.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(58) "//media.digikey.com/photos/Atmel%20Photos/313-20-TSSOP.jpg"
["images"]=>
string(91) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6161/150%7E20TSSOP-4.4%7EO%7E20.jpg"
["images_dir"]=>
string(33) "./images/1075/ATF16V8BQL-15XU.jpg"
["ljbh"]=>
string(17) "ATF16LV8C-10XU-ND"
["zzsbh"]=>
string(14) "ATF16LV8C-10XU"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(3) "845"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["jmgys_id"]=>
NULL
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(23) "IC PLD 8MC 10NS 20TSSOP"
["xl"]=>
string(4) "16V8"
["zzs"]=>
string(16) "Microchip/微芯"
["zzs_new"]=>
string(16) "Microchip/微芯"
["zzs_old"]=>
string(20) "Microchip Technology"
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["kbclx"]=>
string(6) "EE PLD"
["hdys"]=>
string(1) "8"
["dysr"]=>
string(9) "3V ~ 5.5V"
["sd"]=>
string(5) "10 ns"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "20-TSSOP(4.40mm宽)"
["gysqjfz"]=>
string(8) "20-TSSOP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "20"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "1"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(3) "849"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "18"
["wl_num"]=>
string(4) "1075"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(13) "golon_qrs_pld"
["ch_bm"]=>
string(24) "PLD可编程逻辑器件"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
NULL
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
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select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.rate,a.rate_hot,sum(a.rate+a.rate_hot/100) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_pld'
封装：20-TSSOP
外壳：20-TSSOP(4.40mm宽)
描述：
IC PLD 8MC 10NS 20TSSOP
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系列：16V8
可编程类型：EE PLD
宏单元数：8
电压-输入(V)：3V ~ 5.5V
速度：10 ns
工作温度：-
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string(38) "'xl','kbclx','hdys','dysr','sd','gzwd'"
SELECT COLUMN_NAME as bt,COLUMN_COMMENT as title FROM INFORMATION_SCHEMA.Columns WHERE ORDINAL_POSITION >=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_qrs_pld' AND table_schema='golon' and COLUMN_NAME='ms')+1 and ORDINAL_POSITION <=(SELECT ORDINAL_POSITION FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_qrs_pld' AND table_schema='golon' and COLUMN_NAME='is_new_time') and table_name='golon_qrs_pld' AND table_schema='golon' and COLUMN_NAME not in('tdxl','gysqjfz','lm','fz_wk','zzs','tag','wk_cc','zzs_old','zzs_new','ljzt','spq','sqp','is_rohs','bz','gys_id','gm_gys_id','xysl','cfkc','dj','price_addtime','zddgs','spq','moq''gl_zz','gl_dm','gl_dmtp','symbol','gl_vdd','gl_gnd','gl_jz','gl_bdm','gl_bdmsm','gl_kbc','gl_dmgx','pcbfzk_id','pcbfzk','jyid','cat_id','wl_num','admin_id','mpn_bm','ch_bm','lock_dm','is_use_cat_id','is_new_time','gl_zz','gl_pin') and COLUMN_NAME not in ('xl','kbclx','hdys','dysr','sd','gzwd') limit 8
安装类型：表面贴装型
元器件等级：-
最小起订MOQ：5
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