array(65) {
["id"]=>
string(3) "144"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(18) "MCZ33903CS3EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CS3EKR2"
["zddgs"]=>
string(4) "1000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 144 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CS3EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "145"
["pdf_add"]=>
string(78) "//mm.digikey.com/Volume0/opasdata/d220001/medias/docus/364/MC33903%2C4%2C5.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(75) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/795/MCZ33879AEK.JPG"
["images_dir"]=>
string(33) "./images/1076/MCZ33903CS5EKR2.JPG"
["ljbh"]=>
string(18) "MCZ33903CS5EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CS5EKR2"
["zddgs"]=>
string(4) "1000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 145 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
卷带
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CS5EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "146"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CS3EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CS3EK"
["zddgs"]=>
string(3) "924"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 146 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CS3EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "147"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CS5EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CS5EK"
["zddgs"]=>
string(3) "924"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 147 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CS5EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "193"
["pdf_add"]=>
string(49) "http://www.nxp.com/docs/en/data-sheet/MC33975.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(75) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/795/MCZ33879AEK.JPG"
["images_dir"]=>
string(33) "./images/1076/MCZ33903CS5EKR2.JPG"
["ljbh"]=>
string(15) "MC33975TEKR2-ND"
["zzsbh"]=>
string(12) "MC33975TEKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(12) "开关监控"
["jk"]=>
string(10) "SPI 串行"
["dydy"]=>
string(1) "-"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 193 ) LIMIT 1
系列：
应用：开关监控
接口：SPI 串行
电压-电源输入(V)：-
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MC33975TEKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "208"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(18) "MCZ33903CP3EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CP3EKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(3) "CAN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 208 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CP3EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "209"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(18) "MCZ33903CP5EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CP5EKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(3) "CAN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 209 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CP5EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "210"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CP3EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CP3EK"
["zddgs"]=>
string(4) "1050"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(3) "CAN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 210 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CP3EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "211"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CP5EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CP5EK"
["zddgs"]=>
string(4) "1050"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(3) "CAN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 211 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CP5EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "228"
["pdf_add"]=>
string(49) "http://www.nxp.com/docs/en/data-sheet/MC33972.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(75) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/795/MCZ33879AEK.JPG"
["images_dir"]=>
string(33) "./images/1076/MCZ33903CS5EKR2.JPG"
["ljbh"]=>
string(14) "MC33972ATEK-ND"
["zzsbh"]=>
string(11) "MC33972ATEK"
["zddgs"]=>
string(4) "1554"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(12) "开关监控"
["jk"]=>
string(10) "SPI 串行"
["dydy"]=>
string(12) "3.1V ~ 5.25V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 228 ) LIMIT 1
系列：
应用：开关监控
接口：SPI 串行
电压-电源输入(V)：3.1V ~ 5.25V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MC33972ATEK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "229"
["pdf_add"]=>
string(66) "http://cache.freescale.com/files/analog/doc/data_sheet/MC33972.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MC33972ATEKR2-ND"
["zzsbh"]=>
string(13) "MC33972ATEKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(12) "开关监控"
["jk"]=>
string(10) "SPI 串行"
["dydy"]=>
string(12) "3.1V ~ 5.25V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 229 ) LIMIT 1
系列：
应用：开关监控
接口：SPI 串行
电压-电源输入(V)：3.1V ~ 5.25V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MC33972ATEKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "232"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(18) "MCZ33903CD5EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CD5EKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 232 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CD5EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "233"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CD5EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CD5EK"
["zddgs"]=>
string(4) "1512"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 233 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CD5EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "235"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(18) "MCZ33903CD3EKR2-ND"
["zzsbh"]=>
string(15) "MCZ33903CD3EKR2"
["zddgs"]=>
string(4) "2000"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "1000"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 235 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
1000个/
卷带（TR）
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CD3EKR2' ) LIMIT 1
|
array(65) {
["id"]=>
string(3) "236"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903CD3EK-ND"
["zzsbh"]=>
string(13) "MCZ33903CD3EK"
["zddgs"]=>
string(4) "1470"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 236 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903CD3EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(4) "1248"
["pdf_add"]=>
string(65) "http://www.nxp.com/docs/en/data-sheet/MC33903-MC33904-MC33905.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(75) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/795/MCZ33879AEK.JPG"
["images_dir"]=>
string(33) "./images/1076/MCZ33903CS5EKR2.JPG"
["ljbh"]=>
string(16) "MCZ33903BD3EK-ND"
["zzsbh"]=>
string(13) "MCZ33903BD3EK"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "盒"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 1248 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
盒
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903BD3EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(4) "1249"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903BD5EK-ND"
["zzsbh"]=>
string(13) "MCZ33903BD5EK"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "盒"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 1249 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
盒
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903BD5EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(4) "1250"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903BS3EK-ND"
["zzsbh"]=>
string(13) "MCZ33903BS3EK"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "盒"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 1250 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
盒
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903BS3EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(4) "1251"
["pdf_add"]=>
string(72) "http://cache.freescale.com/files/analog/doc/fact_sheet/MC33903_4_5FS.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(81) "https://www.chenkeiot.com/Public/imagesmk/Photos/Freescale_Photos/MCZ33879AEK.JPG"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(16) "MCZ33903BS5EK-ND"
["zzsbh"]=>
string(13) "MCZ33903BS5EK"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(18) "系统基础芯片"
["jk"]=>
string(9) "CAN，LIN"
["dydy"]=>
string(10) "5.5V ~ 28V"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "盒"
["spq"]=>
string(2) "42"
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "停产"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 1251 ) LIMIT 1
系列：
应用：系统基础芯片
接口：CAN，LIN
电压-电源输入(V)：5.5V ~ 28V
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
42个/
盒
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MCZ33903BS5EK' ) LIMIT 1
|
array(65) {
["id"]=>
string(4) "2066"
["pdf_add"]=>
string(49) "http://www.nxp.com/docs/en/data-sheet/MC33975.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(61) "//media.digikey.com/photos/Freescale%20Photos/MCZ33879AEK.JPG"
["images"]=>
string(75) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/795/MCZ33879AEK.JPG"
["images_dir"]=>
string(33) "./images/1076/MCZ33903CS5EKR2.JPG"
["ljbh"]=>
string(13) "MC33975TEK-ND"
["zzsbh"]=>
string(10) "MC33975TEK"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(4) "1386"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(31) "IC INTERFACE SPECIALIZED 32SOIC"
["xl"]=>
string(0) ""
["zzs"]=>
string(13) "NXP/恩智浦"
["zzs_new"]=>
string(9) "未设定"
["zzs_old"]=>
string(12) "NXP USA Inc."
["lm"]=>
string(1) "-"
["tdxl"]=>
string(9) "未设定"
["yy"]=>
string(12) "开关监控"
["jk"]=>
string(10) "SPI 串行"
["dydy"]=>
string(1) "-"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(30) "32-SSOP(7.50mm宽)裸露焊盘"
["gysqjfz"]=>
string(10) "32-SSOP-EP"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(1) "5"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(2) "32"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(1) "-"
["gl_gnd"]=>
string(1) "-"
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "20"
["wl_num"]=>
string(4) "1076"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(11) "golon_jk_zy"
["ch_bm"]=>
string(18) "专用接口芯片"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_jk_zy' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1076"
["parent_id"]=>
string(2) "19"
["lb"]=>
string(26) "接口 专用接口芯片"
["action_name"]=>
string(2) "j1"
["rate"]=>
string(5) "1.055"
["rate_hot"]=>
string(2) "35"
["moq_rate"]=>
string(6) "1.4050"
}
}
封装：32-SSOP-EP
外壳：32-SSOP(7.50mm宽)裸露焊盘
描述：
IC INTERFACE SPECIALIZED 32SOIC
|
SELECT * FROM `golon_jk_zy` WHERE ( `id` = 2066 ) LIMIT 1
系列：
应用：开关监控
接口：SPI 串行
电压-电源输入(V)：-
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:5
修改
包装量:
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MC33975TEK' ) LIMIT 1
|
