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array(69) { ["id"]=> string(3) "110" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "AX125-2FGG324I-ND" ["zzsbh"]=> string(14) "AX125-2FGG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(5) "18432" ["zram_ws"]=> string(3) "168" ["io_num"]=> string(6) "125000" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-2FGG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 110 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：18432
总ram位数：168
i/o 数：125000
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074110
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-2FGG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "111" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "AX125-2FG324I-ND" ["zzsbh"]=> string(13) "AX125-2FG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(4) "2016" ["zram_ws"]=> string(5) "18432" ["io_num"]=> string(3) "168" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-2FG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 111 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：2016
总ram位数：18432
i/o 数：168
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074111
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-2FG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "641" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "AX125-1FGG324-ND" ["zzsbh"]=> string(13) "AX125-1FGG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(5) "18432" ["zram_ws"]=> string(3) "168" ["io_num"]=> string(6) "125000" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-1FGG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 641 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：18432
总ram位数：168
i/o 数：125000
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074641
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-1FGG324' ) LIMIT 1
array(69) { ["id"]=> string(3) "642" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "AX125-1FG324-ND" ["zzsbh"]=> string(12) "AX125-1FG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(5) "18432" ["zram_ws"]=> string(3) "168" ["io_num"]=> string(6) "125000" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-1FG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 642 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：18432
总ram位数：168
i/o 数：125000
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074642
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-1FG324' ) LIMIT 1
array(69) { ["id"]=> string(3) "643" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "AX125-FG324I-ND" ["zzsbh"]=> string(12) "AX125-FG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(5) "18432" ["zram_ws"]=> string(3) "168" ["io_num"]=> string(6) "125000" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-FG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 643 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：18432
总ram位数：168
i/o 数：125000
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074643
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-FG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "644" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "AX125-FGG324I-ND" ["zzsbh"]=> string(13) "AX125-FGG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(4) "2016" ["zram_ws"]=> string(5) "18432" ["io_num"]=> string(3) "168" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-FGG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 644 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：2016
总ram位数：18432
i/o 数：168
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074644
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-FGG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "725" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "AX125-1FGG324I-ND" ["zzsbh"]=> string(14) "AX125-1FGG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(4) "2016" ["zram_ws"]=> string(5) "18432" ["io_num"]=> string(3) "168" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-1FGG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 725 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：2016
总ram位数：18432
i/o 数：168
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074725
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-1FGG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "726" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "AX125-1FG324I-ND" ["zzsbh"]=> string(13) "AX125-1FG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(4) "2016" ["zram_ws"]=> string(5) "18432" ["io_num"]=> string(3) "168" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-1FG324I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 726 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：2016
总ram位数：18432
i/o 数：168
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074726
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-1FG324I' ) LIMIT 1
array(69) { ["id"]=> string(3) "797" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "AX125-2FGG324-ND" ["zzsbh"]=> string(13) "AX125-2FGG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(5) "18432" ["zram_ws"]=> string(3) "168" ["io_num"]=> string(6) "125000" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-2FGG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 797 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：18432
总ram位数：168
i/o 数：125000
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074797
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-2FGG324' ) LIMIT 1
array(69) { ["id"]=> string(3) "798" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130669" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "AX125-2FG324-ND" ["zzsbh"]=> string(12) "AX125-2FG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 168 I/O 324FBGA" ["xl"]=> string(11) "Axcelerator" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(4) "2016" ["ljyj_dys"]=> string(4) "2016" ["zram_ws"]=> string(5) "18432" ["io_num"]=> string(3) "168" ["sjs"]=> string(6) "125000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： AX125-2FG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 168 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 798 ) LIMIT 1
系列：Axcelerator
lab/clb数：2016
逻辑元件/单元数：2016
总ram位数：18432
i/o 数：168
栅极数：125000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074798
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'AX125-2FG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1050" ["pdf_add"]=> string(102) "http://www.microsemi.com/document-portal/doc_download/130702-proasic3l-low-power-flash-fpgas-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(21) "A3PE3000L-1FGG324I-ND" ["zzsbh"]=> string(18) "A3PE3000L-1FGG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3L" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(14) "1.14V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(1) "-" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000L-1FGG324I复制
状态： - 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1050 ) LIMIT 1
系列：ProASIC3L
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.14V ~ 1.575V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：10741050
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000L-1FGG324I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1051" ["pdf_add"]=> string(102) "http://www.microsemi.com/document-portal/doc_download/130702-proasic3l-low-power-flash-fpgas-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "A3PE3000L-1FG324I-ND" ["zzsbh"]=> string(17) "A3PE3000L-1FG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3L" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(14) "1.14V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(1) "-" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000L-1FG324I复制
状态： - 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1051 ) LIMIT 1
系列：ProASIC3L
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.14V ~ 1.575V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：10741051
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000L-1FG324I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1194" ["pdf_add"]=> string(102) "http://www.microsemi.com/document-portal/doc_download/130702-proasic3l-low-power-flash-fpgas-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "A3PE3000L-FGG324I-ND" ["zzsbh"]=> string(17) "A3PE3000L-FGG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3L" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(14) "1.14V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(1) "-" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000L-FGG324I复制
状态： - 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1194 ) LIMIT 1
系列：ProASIC3L
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.14V ~ 1.575V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：10741194
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000L-FGG324I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1195" ["pdf_add"]=> string(102) "http://www.microsemi.com/document-portal/doc_download/130702-proasic3l-low-power-flash-fpgas-datasheet" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "A3PE3000L-FG324I-ND" ["zzsbh"]=> string(16) "A3PE3000L-FG324I" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3L" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(14) "1.14V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(23) "-40°C ~ 100°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(1) "-" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000L-FG324I复制
状态： - 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1195 ) LIMIT 1
系列：ProASIC3L
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.14V ~ 1.575V
工作温度：-40°C ~ 100°C（TJ）
丝印：(请登录)
料号：10741195
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000L-FG324I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1632" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(19) "M1A3PE3000-FG324-ND" ["zzsbh"]=> string(16) "M1A3PE3000-FG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M1A3PE3000-FG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1632 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741632
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M1A3PE3000-FG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1633" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M1A3PE3000-FGG324-ND" ["zzsbh"]=> string(17) "M1A3PE3000-FGG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M1A3PE3000-FGG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1633 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741633
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M1A3PE3000-FGG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1634" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "A3PE3000-FG324-ND" ["zzsbh"]=> string(14) "A3PE3000-FG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000-FG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1634 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741634
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000-FG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1635" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "A3PE3000-FGG324-ND" ["zzsbh"]=> string(15) "A3PE3000-FGG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： A3PE3000-FGG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1635 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741635
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'A3PE3000-FGG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1804" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(21) "M1A3PE3000-1FGG324-ND" ["zzsbh"]=> string(18) "M1A3PE3000-1FGG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M1A3PE3000-1FGG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1804 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741804
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M1A3PE3000-1FGG324' ) LIMIT 1
array(69) { ["id"]=> string(4) "1805" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130701" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["images_dir"]=> string(0) "" ["ljbh"]=> string(20) "M1A3PE3000-1FG324-ND" ["zzsbh"]=> string(17) "M1A3PE3000-1FG324" ["zddgs"]=> string(2) "84" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(23) "IC FPGA 221 I/O 324FBGA" ["xl"]=> string(9) "ProASIC3E" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "516096" ["io_num"]=> string(3) "221" ["sjs"]=> string(7) "3000000" ["dydy"]=> string(15) "1.425V ~ 1.575V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 85°C（TJ）" ["fz_wk"]=> string(7) "324-BGA" ["gysqjfz"]=> string(19) "324-FBGA（19X19）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "324" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： M1A3PE3000-1FG324复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：324-FBGA（19X19）
外壳：324-BGA
描述： IC FPGA 221 I/O 324FBGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1805 ) LIMIT 1
系列：ProASIC3E
lab/clb数：
逻辑元件/单元数：
总ram位数：516096
i/o 数：221
栅极数：3000000
电压-电源(v)：1.425V ~ 1.575V
工作温度：0°C ~ 85°C（TJ）
丝印：(请登录)
料号：10741805
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'M1A3PE3000-1FG324' ) LIMIT 1

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