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array(69) { ["id"]=> string(3) "119" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA300-BGG456-ND" ["zzsbh"]=> string(13) "APA300-BGG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 290 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(5) "73728" ["io_num"]=> string(3) "290" ["sjs"]=> string(6) "300000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA300-BGG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 290 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 119 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：73728
i/o 数：290
栅极数：300000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074119
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA300-BGG456' ) LIMIT 1
array(69) { ["id"]=> string(3) "158" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA150-BG456I-ND" ["zzsbh"]=> string(13) "APA150-BG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 242 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "36864" ["zram_ws"]=> string(3) "242" ["io_num"]=> string(6) "150000" ["sjs"]=> string(6) "150000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA150-BG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 242 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 158 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：36864
总ram位数：242
i/o 数：150000
栅极数：150000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074158
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA150-BG456I' ) LIMIT 1
array(69) { ["id"]=> string(3) "159" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA150-BGG456I-ND" ["zzsbh"]=> string(14) "APA150-BGG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 242 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(5) "36864" ["zram_ws"]=> string(3) "242" ["io_num"]=> string(6) "150000" ["sjs"]=> string(6) "150000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA150-BGG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 242 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 159 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：36864
总ram位数：242
i/o 数：150000
栅极数：150000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074159
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA150-BGG456I' ) LIMIT 1
array(69) { ["id"]=> string(3) "245" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "APA300-BG456-ND" ["zzsbh"]=> string(12) "APA300-BG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 290 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(5) "73728" ["io_num"]=> string(3) "290" ["sjs"]=> string(6) "300000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA300-BG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 290 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 245 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：73728
i/o 数：290
栅极数：300000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：1074245
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA300-BG456' ) LIMIT 1
array(69) { ["id"]=> string(3) "323" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA300-BG456I-ND" ["zzsbh"]=> string(13) "APA300-BG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 290 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(5) "73728" ["io_num"]=> string(3) "290" ["sjs"]=> string(6) "300000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA300-BG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 290 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 323 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：73728
i/o 数：290
栅极数：300000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074323
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA300-BG456I' ) LIMIT 1
array(69) { ["id"]=> string(3) "324" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA300-BGG456I-ND" ["zzsbh"]=> string(14) "APA300-BGG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 290 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(5) "73728" ["io_num"]=> string(3) "290" ["sjs"]=> string(6) "300000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA300-BGG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 290 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 324 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：73728
i/o 数：290
栅极数：300000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：1074324
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA300-BGG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1080" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "APA750-BG456-ND" ["zzsbh"]=> string(12) "APA750-BG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(6) "147456" ["zram_ws"]=> string(3) "356" ["io_num"]=> string(6) "750000" ["sjs"]=> string(6) "750000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA750-BG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1080 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：147456
总ram位数：356
i/o 数：750000
栅极数：750000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741080
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA750-BG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1081" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA750-BGG456-ND" ["zzsbh"]=> string(13) "APA750-BGG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(6) "147456" ["zram_ws"]=> string(3) "356" ["io_num"]=> string(6) "750000" ["sjs"]=> string(6) "750000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA750-BGG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1081 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：147456
总ram位数：356
i/o 数：750000
栅极数：750000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741081
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA750-BGG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1114" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA750-BGG456I-ND" ["zzsbh"]=> string(14) "APA750-BGG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "147456" ["io_num"]=> string(3) "356" ["sjs"]=> string(6) "750000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA750-BGG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1114 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：147456
i/o 数：356
栅极数：750000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741114
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA750-BGG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1115" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA750-BG456I-ND" ["zzsbh"]=> string(13) "APA750-BG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "147456" ["io_num"]=> string(3) "356" ["sjs"]=> string(6) "750000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA750-BG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1115 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：147456
i/o 数：356
栅极数：750000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741115
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA750-BG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1135" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA1000-BG456-ND" ["zzsbh"]=> string(13) "APA1000-BG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "202752" ["io_num"]=> string(3) "356" ["sjs"]=> string(7) "1000000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA1000-BG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1135 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：202752
i/o 数：356
栅极数：1000000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741135
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA1000-BG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1136" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA1000-BGG456-ND" ["zzsbh"]=> string(14) "APA1000-BGG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "202752" ["io_num"]=> string(3) "356" ["sjs"]=> string(7) "1000000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA1000-BGG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1136 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：202752
i/o 数：356
栅极数：1000000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741136
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA1000-BGG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1247" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA600-BGG456I-ND" ["zzsbh"]=> string(14) "APA600-BGG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(6) "129024" ["zram_ws"]=> string(3) "356" ["io_num"]=> string(6) "600000" ["sjs"]=> string(6) "600000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA600-BGG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1247 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：129024
总ram位数：356
i/o 数：600000
栅极数：600000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741247
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA600-BGG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1248" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA600-BG456I-ND" ["zzsbh"]=> string(13) "APA600-BG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(6) "129024" ["zram_ws"]=> string(3) "356" ["io_num"]=> string(6) "600000" ["sjs"]=> string(6) "600000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA600-BG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1248 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：129024
总ram位数：356
i/o 数：600000
栅极数：600000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741248
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA600-BG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1270" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(18) "APA1000-BGG456I-ND" ["zzsbh"]=> string(15) "APA1000-BGG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "202752" ["io_num"]=> string(3) "356" ["sjs"]=> string(7) "1000000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA1000-BGG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1270 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：202752
i/o 数：356
栅极数：1000000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741270
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA1000-BGG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1271" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(17) "APA1000-BG456I-ND" ["zzsbh"]=> string(14) "APA1000-BG456I" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(0) "" ["ljyj_dys"]=> string(0) "" ["zram_ws"]=> string(6) "202752" ["io_num"]=> string(3) "356" ["sjs"]=> string(7) "1000000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(12) "表面贴装" ["gzwd"]=> string(22) "-40°C ~ 85°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA1000-BG456I复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1271 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：
逻辑元件/单元数：
总ram位数：202752
i/o 数：356
栅极数：1000000
电压-电源(v)：2.3V ~ 2.7V
工作温度：-40°C ~ 85°C（TA）
丝印：(请登录)
料号：10741271
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA1000-BG456I' ) LIMIT 1
array(69) { ["id"]=> string(4) "1560" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "APA600-BG456-ND" ["zzsbh"]=> string(12) "APA600-BG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(6) "129024" ["io_num"]=> string(3) "356" ["sjs"]=> string(6) "600000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA600-BG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1560 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：129024
i/o 数：356
栅极数：600000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741560
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA600-BG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1561" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA600-BGG456-ND" ["zzsbh"]=> string(13) "APA600-BGG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 356 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(6) "129024" ["io_num"]=> string(3) "356" ["sjs"]=> string(6) "600000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA600-BGG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 356 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1561 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：129024
i/o 数：356
栅极数：600000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741561
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA600-BGG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1698" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(15) "APA450-BG456-ND" ["zzsbh"]=> string(12) "APA450-BG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 344 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(6) "110592" ["io_num"]=> string(3) "344" ["sjs"]=> string(6) "450000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA450-BG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 344 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1698 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：110592
i/o 数：344
栅极数：450000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741698
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA450-BG456' ) LIMIT 1
array(69) { ["id"]=> string(4) "1699" ["pdf_add"]=> string(81) "http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=130707" ["pdf_dir"]=> string(0) "" ["images_sw"]=> string(1) " " ["images_mk"]=> string(62) "//media.digikey.com/Renders/Microsemi%20Renders/456%20BBGA.jpg" ["images"]=> string(80) "https://www.chenkeiot.com/Public/imagesmk/Renders/Microsemi_Renders/456_BBGA.jpg" ["images_dir"]=> string(0) "" ["ljbh"]=> string(16) "APA450-BGG456-ND" ["zzsbh"]=> string(13) "APA450-BGG456" ["zddgs"]=> string(2) "24" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["jmgys_id"]=> NULL ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(22) "IC FPGA 344 I/O 456BGA" ["xl"]=> string(11) "ProASICPLUS" ["zzs"]=> string(16) "Microchip/微芯" ["zzs_new"]=> string(9) "未设定" ["zzs_old"]=> string(13) "Microsemi SoC" ["lm"]=> string(1) "-" ["tdxl"]=> string(9) "未设定" ["lab_clb"]=> string(1) "-" ["ljyj_dys"]=> string(1) "-" ["zram_ws"]=> string(6) "110592" ["io_num"]=> string(3) "344" ["sjs"]=> string(6) "450000" ["dydy"]=> string(11) "2.3V ~ 2.7V" ["azlx"]=> string(15) "表面贴装型" ["gzwd"]=> string(20) "0°C ~ 70°C（TA）" ["fz_wk"]=> string(8) "456-BBGA" ["gysqjfz"]=> string(19) "456-PBGA（35X35）" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["is_rohs"]=> string(1) "1" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(3) "456" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(1) "-" ["gl_gnd"]=> string(1) "-" ["gl_jz"]=> string(1) " " ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "1" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "在售" ["jyid"]=> string(1) "-" ["cat_id"]=> string(2) "17" ["wl_num"]=> string(4) "1074" ["admin_id"]=> string(1) "0" ["mpn_bm"]=> string(14) "golon_qrs_fpga" ["ch_bm"]=> string(28) "FPGA现场可编程门阵列" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> NULL ["spq"]=> NULL ["moq"]=> string(1) "5" ["bz"]=> string(0) "" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_qrs_fpga' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1074" ["parent_id"]=> string(1) "8" ["lb"]=> string(39) "嵌入式 FPGA现场可编程门阵列" ["action_name"]=> string(2) "q8" ["rate"]=> string(5) "1.065" ["rate_hot"]=> string(2) "25" ["moq_rate"]=> string(6) "1.3150" } }
型号： APA450-BGG456复制
状态： 在售 修改
品牌： Microchip/微芯复制
封装：456-PBGA（35X35）
外壳：456-BBGA
描述： IC FPGA 344 I/O 456BGA
SELECT * FROM `golon_qrs_fpga` WHERE ( `id` = 1699 ) LIMIT 1
系列：ProASICPLUS
lab/clb数：-
逻辑元件/单元数：-
总ram位数：110592
i/o 数：344
栅极数：450000
电压-电源(v)：2.3V ~ 2.7V
工作温度：0°C ~ 70°C（TA）
丝印：(请登录)
料号：10741699
量大可议价
起订量:5 修改
包装量: 修改
个
咨询客服
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'APA450-BGG456' ) LIMIT 1

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