array(64) {
["id"]=>
string(3) "701"
["pdf_add"]=>
string(64) "https://datasheets.maximintegrated.com/en/ds/MAX6495-MAX6499.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(17) "MAX6495ATT+TTR-ND"
["zzsbh"]=>
string(12) "MAX6495ATT+T"
["zddgs"]=>
string(4) "2500"
["xysl"]=>
string(4) "2500"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "47.428520"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(30) "IC OVERVOLTAGE PROT CTRL 6TDFN"
["xl"]=>
string(0) ""
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(21) "过压保护控制器"
["yy"]=>
string(9) "汽车级"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "1"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC OVERVOLTAGE PROT CTRL 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 701 ) LIMIT 1
系列：
类型：过压保护控制器
应用：汽车级
工作温度：-
|
|
10+:
￥76.22
2500+:
￥53.45
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'MAX6495ATT+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(3) "859"
["pdf_add"]=>
string(78) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS2413.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(14) "DS2413Q+T&R-ND"
["zzsbh"]=>
string(11) "DS2413Q+T&R"
["zddgs"]=>
string(4) "2500"
["xysl"]=>
string(1) "0"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "16.926250"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(27) "IC ADDRESSABLE SWITCH 6TDFN"
["xl"]=>
string(0) ""
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(15) "可寻址开关"
["yy"]=>
string(65) "配件 ID 和控制，工业控制器，LED 控制，系统监控"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(14) "卷带（TR）"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
string(0) ""
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "1"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(1) "0"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC ADDRESSABLE SWITCH 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 859 ) LIMIT 1
系列：
类型：可寻址开关
应用：配件 ID 和控制，工业控制器，LED 控制，系统监控
工作温度：-
|
|
10+:
￥27.20
2500+:
￥19.08
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带（TR）
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS2413Q+T&R' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1088"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28C36.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28C36Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(28) "IC AUTHENTICATION CHIP 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(15) "网络和通信"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "带"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1505796299"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC AUTHENTICATION CHIP 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1088 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：网络和通信
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28C36Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1092"
["pdf_add"]=>
string(78) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds2476.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(9) "DS2476Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(32) "IC SECURITY COMPANION CHIP 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(18) "安全辅助芯片"
["yy"]=>
string(15) "网络和通信"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "带"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1505796303"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC SECURITY COMPANION CHIP 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1092 ) LIMIT 1
系列：DeepCover®
类型：安全辅助芯片
应用：网络和通信
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS2476Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1179"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28C36.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28C36Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "17.286660"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(28) "IC AUTHENTICATION CHIP 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(15) "网络和通信"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1528079412"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC AUTHENTICATION CHIP 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1179 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：网络和通信
工作温度：-
|
|
10+:
￥27.78
2500+:
￥19.48
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28C36Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1191"
["pdf_add"]=>
string(78) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds2476.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(1) "-"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(9) "DS2476Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "15.931900"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(32) "IC SECURITY COMPANION CHIP 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(18) "安全辅助芯片"
["yy"]=>
string(15) "网络和通信"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1528079455"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC SECURITY COMPANION CHIP 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1191 ) LIMIT 1
系列：DeepCover®
类型：安全辅助芯片
应用：网络和通信
工作温度：-
|
|
10+:
￥25.60
2500+:
￥17.96
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS2476Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1243"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e50.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E50Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1548056074"
["ms"]=>
string(32) "PUF ENABLED SHA-3 SECURE AUTHENT"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(9) "医用型"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e8822aced13a.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1548055412"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
PUF ENABLED SHA-3 SECURE AUTHENT
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1243 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：医用型
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
管件
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E50Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1252"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e50.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E50Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "13.293180"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(32) "PUF ENABLED SHA-3 SECURE AUTHENT"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(9) "医用型"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e8822aced13a.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1548055462"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
PUF ENABLED SHA-3 SECURE AUTHENT
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1252 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：医用型
工作温度：-
|
|
10+:
￥21.36
2500+:
￥14.98
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E50Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1253"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e83.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E83Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "16.684220"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(32) "1-WIRE 5K RAD SECURE AUTHENTICAT"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(9) "医用型"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e88242a60d1b.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1548055469"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
1-WIRE 5K RAD SECURE AUTHENTICAT
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1253 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：医用型
工作温度：-
|
|
10+:
￥26.81
2500+:
￥18.80
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E83Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1267"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E39.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E39Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1554173287"
["ms"]=>
string(32) "PUF ENABLED SHA-3 SECURE AUTHENT"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e88281d1bfb3.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1554170408"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
PUF ENABLED SHA-3 SECURE AUTHENT
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1267 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
管件
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E39Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1268"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e83.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E83Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1554170565"
["ms"]=>
string(28) "IC AUTHENTICATION CHIP 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(9) "医用型"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "散装"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e88242a60d1b.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1554170418"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC AUTHENTICATION CHIP 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1268 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：医用型
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
散装
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E83Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1430"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E38.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E38Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "16.816660"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1585982186"
["ms"]=>
string(24) "IC EEPROM 2K 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(5) "28E38"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-04/5e882ab1f051f.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "1"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085848"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 2K 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1430 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
10+:
￥27.02
2500+:
￥18.95
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E38Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1432"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e15.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E15Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "12.080810"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(25) "IC EEPROM 512 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-04/5e8832e240a4e.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(21) "2脚IO 其他引脚NC"
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085859"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 512 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1432 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
10+:
￥19.41
2500+:
￥13.62
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E15Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1433"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/ds28e22.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E22Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "12.791390"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1556086065"
["ms"]=>
string(24) "IC EEPROM 2K 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-09/5e8f3a6c92806.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085868"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 2K 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1433 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
10+:
￥20.56
2500+:
￥14.42
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E22Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1626"
["pdf_add"]=>
string(1) "-"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
NULL
["images"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28C50Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(30) "SECURE AUTHENTICATOR SHA-3 PUF"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(1) "-"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(2) "10"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "21"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1598343583"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
SECURE AUTHENTICATOR SHA-3 PUF
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1626 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：-
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
10个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28C50Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1627"
["pdf_add"]=>
string(56) "https://datasheets.maximintegrated.com/en/ds/DS28C39.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
NULL
["images"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images_dir"]=>
string(0) ""
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28C39Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(27) "I2C PUF ECDSA AUTHENTICATOR"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(1) "-"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(0) ""
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(1) " "
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(2) "21"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1598343584"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
I2C PUF ECDSA AUTHENTICATOR
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1627 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：-
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28C39Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1446"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E38.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(79) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/642/6-TDFN_21-0137I.jpg"
["images_dir"]=>
string(28) "./images/1061/DS28E38Q+U.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E38Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1585982186"
["ms"]=>
string(24) "IC EEPROM 2K 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(3) "带"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(5) "28E38"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-04/5e882ab1f051f.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "1"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085929"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 2K 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1446 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
带
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E38Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1447"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E36.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E36Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1585981803"
["ms"]=>
string(24) "IC EEPROM 8K 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-04/5e8829cb976c8.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085936"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 8K 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1447 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
管件
修改
咨询客服
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E36Q+U' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1448"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E36.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(63) "//media.digikey.com/renders/Maxim%20Renders/6-TDFN_21-0137I.jpg"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E36Q+T"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(9) "15.491200"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(10) "1585981803"
["ms"]=>
string(24) "IC EEPROM 8K 1WIRE 6TDFN"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "卷带"
["spq"]=>
string(4) "2500"
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(36) "CcqGlDm/2020-04-04/5e8829cb976c8.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085946"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
IC EEPROM 8K 1WIRE 6TDFN
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1448 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
10+:
￥24.89
2500+:
￥17.46
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
2500个/
卷带
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E36Q+T' ) LIMIT 1
|
array(64) {
["id"]=>
string(4) "1449"
["pdf_add"]=>
string(79) "https://www.analog.com/media/en/technical-documentation/data-sheets/DS28E16.pdf"
["pdf_dir"]=>
string(0) ""
["images_sw"]=>
string(1) " "
["images_mk"]=>
string(1) "-"
["images"]=>
string(87) "//mm.digikey.com/Volume0/opasdata/d220001/medias/images/6165/175%7E21-0137%7ETT%7E6.jpg"
["images_dir"]=>
string(30) "./images/1061/MAX6495ATT+T.jpg"
["ljbh"]=>
string(0) ""
["zzsbh"]=>
string(10) "DS28E16Q+U"
["zddgs"]=>
string(1) "1"
["xysl"]=>
string(1) "1"
["cfkc"]=>
string(1) "0"
["dj"]=>
string(8) "0.000000"
["gys_id"]=>
string(1) " "
["num"]=>
string(1) " "
["price_addtime"]=>
string(1) "0"
["ms"]=>
string(29) "DEEPCOVER SECURE AUTHEN SHA-3"
["xl"]=>
string(11) "DeepCover®"
["zzs"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_new"]=>
string(26) "ADI(Maxim美信)/亚德诺"
["zzs_old"]=>
string(36) "Analog Devices Inc./Maxim Integrated"
["lm"]=>
string(6) "未设"
["tdxl"]=>
string(9) "未设定"
["lx"]=>
string(12) "验证芯片"
["yy"]=>
string(21) "身份验证，安全"
["azlx"]=>
string(15) "表面贴装型"
["fz_wk"]=>
string(19) "6-WDFN 裸露焊盘"
["gysqjfz"]=>
string(15) "6-TDFN（3x3）"
["gzwd"]=>
string(1) "-"
["djs"]=>
string(1) "-"
["tag"]=>
string(1) " "
["bz"]=>
string(6) "管件"
["spq"]=>
string(0) ""
["moq"]=>
string(2) "10"
["is_rohs"]=>
string(1) "1"
["gl_zz"]=>
string(6) "贴片"
["gl_pin"]=>
string(1) "6"
["gl_dm"]=>
string(1) "-"
["gl_dmtp"]=>
string(35) "IcGlDm/2020-04-04/5e8826bda2387.jpg"
["symbol"]=>
string(0) ""
["gl_vdd"]=>
string(0) ""
["gl_gnd"]=>
string(0) ""
["gl_jz"]=>
string(0) ""
["gl_bdm"]=>
string(1) "4"
["gl_bdmsm"]=>
NULL
["gl_kbc"]=>
string(1) "0"
["gl_dmgx"]=>
string(1) "0"
["pcbfzk_id"]=>
string(0) ""
["pcbfzk"]=>
string(1) "-"
["ljzt"]=>
string(6) "在售"
["jyid"]=>
string(1) "-"
["cat_id"]=>
string(1) "3"
["wl_num"]=>
string(4) "1061"
["admin_id"]=>
string(1) "0"
["mpn_bm"]=>
string(8) "golon_ic"
["ch_bm"]=>
string(8) "专用IC"
["lock_dm"]=>
string(1) "1"
["is_use_cat_id"]=>
string(1) "0"
["is_new_time"]=>
string(10) "1556085947"
["ms_c"]=>
string(1) " "
["ytfw"]=>
string(1) "-"
["hot_or_top"]=>
string(1) "0"
["yqjtd_pintopin"]=>
string(1) " "
["yqjtd_jianrong"]=>
string(1) " "
}
|
select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) {
[0]=>
array(7) {
["wl_num"]=>
string(4) "1061"
["parent_id"]=>
string(1) "2"
["lb"]=>
string(22) "专用芯片 专用IC"
["action_name"]=>
string(2) "i1"
["rate"]=>
string(5) "1.127"
["rate_hot"]=>
string(2) "48"
["moq_rate"]=>
string(6) "1.6070"
}
}
封装：6-TDFN（3x3）
外壳：6-WDFN 裸露焊盘
描述：
DEEPCOVER SECURE AUTHEN SHA-3
|
SELECT * FROM `golon_ic` WHERE ( `id` = 1449 ) LIMIT 1
系列：DeepCover®
类型：验证芯片
应用：身份验证，安全
工作温度：-
|
|
|
购买数量不能超过商品库存，已为您修正！
起订量:10
修改
包装量:
管件
修改
总额：
|
SELECT count(a.gys_id) as c FROM golon_gys_file_new a LEFT JOIN golon_gys_brand b on a.gys_id=b.id WHERE ( a.zzsbh = 'DS28E16Q+U' ) LIMIT 1
|
