Renesas###Renesas Electronics America公司介绍和产品目录_Renesas/瑞萨_瑞萨电子专区_授权代理商 - 辰科物联

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封装图	商品描述	综合参数	封装规格/资料	价格(含税)	数量	操作
array(62) { ["id"]=> string(3) "468" ["pdf_add"]=> string(45) "http://www.idt.com/document/88p8341-datasheet" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["ljbh"]=> string(14) "88P8341BHGI-ND" ["zzsbh"]=> string(11) "88P8341BHGI" ["zddgs"]=> string(2) "96" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(31) "IC SYST PACK INTERFACE 820TEBGA" ["xl"]=> string(0) "" ["zzs"]=> string(14) "Renesas/瑞萨" ["zzs_new"]=> string(14) "Renesas/瑞萨" ["zzs_old"]=> string(31) "Renesas Electronics America Inc" ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(24) "系统包接口（SPI）" ["yy"]=> string(1) "-" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(20) "820-BGA 裸露焊盘" ["gysqjfz"]=> string(20) "820-TEBGA（35x35）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "96" ["moq"]=> string(2) "10" ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(1) "-" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(0) "" ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(1) "3" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "1" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： 88P8341BHGI复制状态：停产修改品牌： Renesas/瑞萨复制封装：820-TEBGA（35x35）外壳：820-BGA 裸露焊盘描述： IC SYST PACK INTERFACE 820TEBGA	SELECT * FROM `golon_ic` WHERE ( `id` = 468 ) LIMIT 1 系列：类型：系统包接口（SPI）应用：- 工作温度：-	类别：专用IC 丝印：(请登录) 料号：1061468 资料：规格书/封装库	0755-28435922 量大可议价	购买数量不能超过商品库存，已为您修正！起订量:10 修改包装量: 96个/ 托盘修改个个托盘咨询客服	加入购物车
array(62) { ["id"]=> string(3) "469" ["pdf_add"]=> string(45) "http://www.idt.com/document/88p8342-datasheet" ["images_sw"]=> string(1) " " ["images_mk"]=> string(1) "-" ["images"]=> string(1) " " ["ljbh"]=> string(14) "88P8342BHGI-ND" ["zzsbh"]=> string(11) "88P8342BHGI" ["zddgs"]=> string(2) "96" ["xysl"]=> string(1) "0" ["cfkc"]=> string(1) "0" ["dj"]=> string(8) "0.000000" ["gys_id"]=> string(1) " " ["num"]=> string(1) " " ["price_addtime"]=> string(1) "0" ["ms"]=> string(24) "IC SPI EXCHANGE 820TEBGA" ["xl"]=> string(0) "" ["zzs"]=> string(14) "Renesas/瑞萨" ["zzs_new"]=> string(14) "Renesas/瑞萨" ["zzs_old"]=> string(31) "Renesas Electronics America Inc" ["lm"]=> string(6) "未设" ["tdxl"]=> string(9) "未设定" ["lx"]=> string(10) "SPI 交换" ["yy"]=> string(1) "-" ["azlx"]=> string(15) "表面贴装型" ["fz_wk"]=> string(20) "820-BGA 裸露焊盘" ["gysqjfz"]=> string(20) "820-TEBGA（35x35）" ["gzwd"]=> string(1) "-" ["djs"]=> string(1) "-" ["tag"]=> string(1) " " ["bz"]=> string(6) "托盘" ["spq"]=> string(2) "96" ["moq"]=> string(2) "10" ["is_rohs"]=> string(1) "0" ["gl_zz"]=> string(6) "贴片" ["gl_pin"]=> string(1) "-" ["gl_dm"]=> string(1) "-" ["gl_dmtp"]=> string(0) "" ["symbol"]=> string(0) "" ["gl_vdd"]=> string(0) "" ["gl_gnd"]=> string(0) "" ["gl_jz"]=> string(0) "" ["gl_bdm"]=> string(1) "4" ["gl_bdmsm"]=> string(0) "" ["gl_kbc"]=> string(1) "0" ["gl_dmgx"]=> string(1) "0" ["pcbfzk_id"]=> string(0) "" ["pcbfzk"]=> string(1) "-" ["ljzt"]=> string(6) "停产" ["jyid"]=> string(1) "-" ["cat_id"]=> string(1) "3" ["wl_num"]=> string(4) "1061" ["admin_id"]=> string(1) "1" ["mpn_bm"]=> string(8) "golon_ic" ["ch_bm"]=> string(8) "专用IC" ["lock_dm"]=> string(1) "1" ["is_use_cat_id"]=> string(1) "0" ["is_new_time"]=> string(1) "0" ["ms_c"]=> string(1) " " ["ytfw"]=> string(1) "-" ["hot_or_top"]=> string(1) "0" ["yqjtd_pintopin"]=> string(1) " " ["yqjtd_jianrong"]=> string(1) " " }	select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_ic' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1061" ["parent_id"]=> string(1) "2" ["lb"]=> string(22) "专用芯片专用IC" ["action_name"]=> string(2) "i1" ["rate"]=> string(5) "1.127" ["rate_hot"]=> string(2) "48" ["moq_rate"]=> string(6) "1.6070" } } 型号： 88P8342BHGI复制状态：停产修改品牌： Renesas/瑞萨复制封装：820-TEBGA（35x35）外壳：820-BGA 裸露焊盘描述： IC SPI EXCHANGE 820TEBGA	SELECT * FROM `golon_ic` WHERE ( `id` = 469 ) LIMIT 1 系列：类型：SPI 交换应用：- 工作温度：-	类别：专用IC 丝印：(请登录) 料号：1061469 资料：规格书/封装库	0755-28435922 量大可议价	购买数量不能超过商品库存，已为您修正！起订量:10 修改包装量: 96个/ 托盘修改个个托盘咨询客服	加入购物车

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