select a.wl_num,a.parent_id,GROUP_CONCAT(b.cat_name,' ',a.cat_name) as lb,a.action_name,a.rate,a.rate_hot,ROUND(sum(a.rate+a.rate_hot/100),4) as moq_rate from golon_ics_category a left join golon_ics_category b on a.parent_id=b.id where a.mpn_bm='golon_rf_kg' array(1) { [0]=> array(7) { ["wl_num"]=> string(4) "1176" ["parent_id"]=> string(3) "152" ["lb"]=> string(26) "射频元器件 RF 开关" ["action_name"]=> string(3) "r10" ["rate"]=> string(5) "1.103" ["rate_hot"]=> string(2) "35" ["moq_rate"]=> string(6) "1.4530" } }

封装：16-LFCSP（3X3）

外壳：16-VFQFN 裸露焊盘，CSP

描述： IC REFL SW SP4T