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图片 | 型号 | 制造商 | 封装/外壳 | 供应商器件封装 | 描述参数 |
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LTC4403-1EMS8#TRPBF
Datasheet 规格书
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Linear Technology | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-MSOP |
描述:IC RF PWR CNTRL 2.4GHZ SGL 8MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2.4GHz
*特性:单输出
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-MSOP
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LTC1757A-2EMS#PBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2GHZ DUAL 10MSOP
*类型:手机,GSM,PCS,无线调制解调器,TDMA
*频率:850MHz ~ 2GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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LTC4401-2EMS8#TRPBF
Datasheet 规格书
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Linear Technology | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-MSOP |
描述:IC RF PWR CNTRL 2GHZ DUAL 8MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2GHz
*特性:双输出
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-MSOP
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LTC1757A-2EMS#TRPBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2GHZ DUAL 10MSOP
*类型:手机,GSM,PCS,无线调制解调器,TDMA
*频率:850MHz ~ 2GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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LTC4402-2EMS#PBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2.4GHZ DL 10MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2.4GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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LTC4403-2EMS#PBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2.4GHZ DL 10MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2.4GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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LTC4403-2EMS#TRPBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2.4GHZ DL 10MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2.4GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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LTC4402-2EMS#TRPBF
Datasheet 规格书
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Linear Technology | 10-TFSOP,10-MSOP(3.00MM 宽) | 10-MSOP |
描述:IC RF PWR CNTRL 2.4GHZ DL 10MSOP
*类型:手机,GSM,GPRS,PCS,无线调制解调器,TDMA
*频率:300MHz ~ 2.4GHz
*特性:双输出
封装/外壳:10-TFSOP,10-MSOP(3.00MM 宽)
供应商器件封装:10-MSOP
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DS1870E-010+T&R
Datasheet 规格书
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Maxim Integrated | 16-TSSOP(宽4.40mm间距0.65mm) | 16-TSSOP |
描述:IC RF PWR CNTRL PA 16TSSOP
*类型:手机
*频率:-
*特性:-
封装/外壳:16-TSSOP(宽4.40mm间距0.65mm)
供应商器件封装:16-TSSOP
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AD8315ACPZ-REEL7
Datasheet 规格书
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Analog Devices Inc. | 8-VFDFN 裸露焊盘,CSP | 8-LFCSP-VD(3X2) |
描述:IC RF PWR CNTRL PA 2.5GHZ 8LFCSP
*类型:GSM,EDGE
*频率:100MHz ~ 2.5GHz
*特性:功率放大器控制器
封装/外壳:8-VFDFN 裸露焊盘,CSP
供应商器件封装:8-LFCSP-VD(3X2)
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AD8315ARMZ-RL
Datasheet 规格书
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Analog Devices Inc. | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-MSOP |
描述:IC RF PWR CNTRL PA 2.5GHZ 8MSOP
*类型:DCS,GSM,ISM
*频率:100MHz ~ 2.5GHz
*特性:功率放大器控制器
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-MSOP
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AD8315ARMZ
Datasheet 规格书
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Analog Devices Inc. | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-MSOP |
描述:IC RF PWR CNTRL PA 2.5GHZ 8MSOP
*类型:DCS,GSM,ISM
*频率:100MHz ~ 2.5GHz
*特性:功率放大器控制器
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-MSOP
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MAX4473ESA
Datasheet 规格书
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Maxim Integrated | 8-SOIC(宽3.9MM间距1.27MM) | 8-SOIC |
描述:IC RF PWR CNTRL AMP PA GSM 8SOIC
*类型:GSM
*频率:-
*特性:-
封装/外壳:8-SOIC(宽3.9MM间距1.27MM)
供应商器件封装:8-SOIC
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MAX4473EUA
Datasheet 规格书
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Maxim Integrated | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-UMAX |
描述:IC RF PWR CNTRL AMP PA GSM 8UMAX
*类型:GSM
*频率:-
*特性:-
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-UMAX
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LMV248LQ
Datasheet 规格书
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Texas Instruments | 16-WFQFN 裸露焊盘 | 16-WQFN(4X4) |
描述:IC RF PWR CNTRL DUAL BAND 16WQFN
*类型:手机,GSM,DCS,PCS
*频率:-
*特性:双频带
封装/外壳:16-WFQFN 裸露焊盘
供应商器件封装:16-WQFN(4X4)
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LMV243BL
Datasheet 规格书
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Texas Instruments | 8-VFBGA,DSBGA | 8-DSBGA(1.51X1.51) |
描述:IC RF PWR CNTRL 2GHZ 8DSBGA
*类型:手机,GSM,TDMA,WLL
*频率:450MHz ~ 2GHz
*特性:电源控制器
封装/外壳:8-VFBGA,DSBGA
供应商器件封装:8-DSBGA(1.51X1.51)
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X9470V24I
Datasheet 规格书
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Intersil | 24-TSSOP(0.173",4.40MM 宽) | 24-TSSOP-EP |
描述:IC RF PWR CNTRL BIAS PA 24TSSOP
*类型:CDMA,GSM,EDGE
*频率:-
*特性:-
封装/外壳:24-TSSOP(0.173",4.40MM 宽)
供应商器件封装:24-TSSOP-EP
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TPS65040ZQER
Datasheet 规格书
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Texas Instruments | 71-VFBGA | 71-BGA MICROSTAR JUNIOR |
描述:IC RF PWR CNTRL PA MICROSTAR JR
*类型:手机,W-CDMA,CDMA,GSM,UMTS
*频率:-
*特性:功率放大器控制器
封装/外壳:71-VFBGA
供应商器件封装:71-BGA MICROSTAR JUNIOR
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LMV243BLX/NOPB
Datasheet 规格书
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Texas Instruments | 8-VFBGA,DSBGA | 8-DSBGA(1.51X1.51) |
描述:IC RF PWR CNTRL QUAD 2GHZ 8DSBGA
*类型:GSM
*频率:450MHz ~ 2GHz
*特性:四频带
封装/外壳:8-VFBGA,DSBGA
供应商器件封装:8-DSBGA(1.51X1.51)
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LMV242LDX/NOPB
Datasheet 规格书
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Texas Instruments | 10-WFDFN 裸露焊盘 | 10-WSON(3X3) |
描述:IC RF PWR CNTRL PA 2GHZ 10WSON
*类型:手机,GSM,GPRS,TDMA,TD-SCDMA,WLL
*频率:450MHz ~ 2GHz
*特性:功率放大器控制器
封装/外壳:10-WFDFN 裸露焊盘
供应商器件封装:10-WSON(3X3)
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TPS65040ZQE
Datasheet 规格书
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Texas Instruments | 71-VFBGA | 71-BGA MICROSTAR JUNIOR |
描述:IC RF PWR CNTRL PA 71MICROST JR
*类型:手机,W-CDMA,CDMA,GSM,UMTS
*频率:-
*特性:功率放大器控制器
封装/外壳:71-VFBGA
供应商器件封装:71-BGA MICROSTAR JUNIOR
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LMV242LDX
Datasheet 规格书
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Texas Instruments | 10-WFDFN 裸露焊盘 | 10-WSON(3X3) |
描述:IC RF PWR CNTRL PA 2GHZ 10WSON
*类型:手机,GSM,GPRS,TDMA,TD-SCDMA,WLL
*频率:450MHz ~ 2GHz
*特性:功率放大器控制器
封装/外壳:10-WFDFN 裸露焊盘
供应商器件封装:10-WSON(3X3)
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LMV242LD
Datasheet 规格书
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Texas Instruments | 10-WFDFN 裸露焊盘 | 10-WSON(3X3) |
描述:IC RF PWR CNTRL PA 2GHZ 10WSON
*类型:手机,GSM,GPRS,TDMA,TD-SCDMA,WLL
*频率:450MHz ~ 2GHz
*特性:功率放大器控制器
封装/外壳:10-WFDFN 裸露焊盘
供应商器件封装:10-WSON(3X3)
标签:
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MAX4473ESA-T
Datasheet 规格书
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Maxim Integrated | 8-SOIC(宽3.9MM间距1.27MM) | 8-SOIC |
描述:IC AMP PA PWR GSM CTRL 8-SOIC
*类型:GSM
*频率:-
*特性:-
封装/外壳:8-SOIC(宽3.9MM间距1.27MM)
供应商器件封装:8-SOIC
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MAX4473EUA-T
Datasheet 规格书
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Maxim Integrated | 8-TSSOP,8-MSOP(3.00MM 宽) | 8-UMAX |
描述:IC AMP PA PWR CONTROL 8-UMAX
*类型:GSM
*频率:-
*特性:-
封装/外壳:8-TSSOP,8-MSOP(3.00MM 宽)
供应商器件封装:8-UMAX
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